MATERIAL 02
Thermally Conductive PI Film
Thermal pathways built into the PI backbone
ModelsDJ07 / DJ06
Thickness25 – 50 μm
Import SubstitutionDuPont
Overview
Manufactured with special fillers and formulation on the basis of standard PI film, retaining high-temperature resistance, radiation resistance and chemical stability while adding excellent thermal conductivity. 0.4–0.6 W/m·K is in mass production; higher grades are in technical reserve.
FeaturesFEATURES
- 0.4–0.6 W/m·K in mass production
- 1.0 W/m·K in reserve
- High-temperature & radiation resistant
- Stable roll supply
Applications
Related products
SPECSpecifications
| Models | Thickness μm | Tensile MPa | Elongation % | Modulus GPa | Dielectric kV/mm | Note |
|---|---|---|---|---|---|---|
| DJ07 | 25 / 38 / 50 | ≥90 / ≥80 | ≥10 | ≥4.5 | ≥140 / ≥120 / ≥100 | 导热 ≥0.4 W/m·K |
| DJ06 | 25 / 38 / 50 | ≥90 / ≥80 | ≥30 | ≥4.5 | ≥110 / ≥110 / ≥120 | 导热 ≥0.6 W/m·K |
Typical values. Final data per test report and technical datasheet.
Related products
03
PI Graphite Film
DJ02 / DJ03 · 25 – 50 μm
Graphitized at 2800℃, 1500 W/m·K in-plane
01
Aviation Composite Film
DJ561 / DJ515 / DJ30 · 30 – 50 μm
Insulation and corrosion protection for aerospace cables
04
Colorless Transparent PI Film
DJ01 / DJ03 / DJ03A · 25 – 50 μm
Transmittance ≥85%, haze ≤1.5%
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