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MATERIAL 06

Biaxially Drawn High-Modulus PI Film

Modulus 4–9 GPa, CTE 19 ppm/℃

Models:DJ02 Thickness:18 – 50 μm Substrate & Circuit Films
Biaxially Drawn High-Modulus PI Film
ModelsDJ02
Thickness18 – 50 μm
Import SubstitutionIn-house

Overview

Produced with a special formulation and biaxial stretching. Standout properties: ultra-high modulus and strength, excellent flex resistance, very low CTE and strong corrosion resistance.

FeaturesFEATURES

  • Modulus 4–9 GPa
  • CTE 19±3 ppm/℃, lower than copper
  • Flex and corrosion resistant
  • Excellent dimensional stability

Applications

Foldable phonesLaptopsAerospace composite substratesOil-field motors, sputtering

Related products

In-house formulation
Consumer ElectronicsNew Energy Vehicles

SPECSpecifications

ModelsThickness μm Tensile MPaElongation % Modulus GPaDielectric kV/mm Note
DJ0218±1.5≥300≥35≥6.0≥200CTE 19 ppm/℃
DJ0225±1.5≥380≥40≥6.0≥160CTE 19 ppm/℃
DJ0250±2≥300≥35≥5.5≥120CTE 19 ppm/℃

Typical values. Final data per test report and technical datasheet.

Need samples or a datasheet?

Full parameters, test reports and substitution tables. Samples dispatched within 48 hours.

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