MATERIAL 11
Low-Dk Low-Df MPI Film
For 10–15 GHz high-frequency signal handling

ModelsMPI / MPI-F
Thickness25 – 50 μm
Import SubstitutionSKC
Overview
Built on modified polymer structures and special monomers with good mechanical and thermal performance. Dk, Df, moisture absorption and transmission loss sit between PI and LCP, meeting 5G requirements at 10–15 GHz. MPI-F adds a fluoropolymer adhesive on both sides for copper bonding.
FeaturesFEATURES
- Low loss at 10–15 GHz
- Between PI and LCP
- Fluoropolymer coating for copper bonding
- Benchmarked against SKC
Applications
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SPECSpecifications
| Models | Thickness μm | Tensile MPa | Elongation % | Modulus GPa | Dielectric kV/mm | Note |
|---|---|---|---|---|---|---|
| MPI | 25 / 50 | — | — | — | — | 10–15 GHz 低介电低损耗 |
| MPI-F | 25 / 50 | — | — | — | — | 双侧含氟胶,可与铜箔压合 |
Typical values. Final data per test report and technical datasheet.
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